【THENGA 2 THOLA 1 KWAMAHHALA】20g BGA I-Syringe Tin Solder Paste Eholayo Sn63/Pb37 Melting Point 183℃

【THENGA 2 THOLA 1 KWAMAHHALA】20g BGA I-Syringe Tin Solder Paste Eholayo Sn63/Pb37 Melting Point 183℃

Wonke umuntu othengisa kufanele abe nayo le kit lapho

UMKlamo OBUHLELE
Ukusekelwa okusha kwezobuchwepheshe, ifomula yamakhemikhali eyingqayizivele inikeza ukumanzisa okuhle kakhulu, ukuze kuqinisekiswe ukuthembeka okuphezulu.Kushintshwe embonini yokulungisa umakhalekhukhwini, izimboni zesevisi yedijithali yekhompiyutha kanye nezinqubo ze-high-presicion circuit board soldering SMT/BGA soldering.

I-PCB/BGA ZINIKELWE
Ikhwalithi ephezulu, ifomula eyingqayizivele, ukusebenza okuphelele, kulula ukushisela, i-solder joint igqamile futhi igcwele, ayikho i-weld, i-welding yamanga.

IYASEBENZA KAKHULU
Okusele akunambala futhi kusobala, akuthinti ukutholwa, ukulahlwa kanye nokusebenza okuhle kakhulu kokuhlanza. Ukusetshenziswa kwamandla asebenzayo e-thixotropic agents, ukuphrinta nokuwa kwe-preheating, i-solder ekhethekile iqinisekisa ukuphrinta okuhle kanye nephethini enhle.

UKUPHILA KWE-REVOLUTIONARY
Ukumanzisa, ukomisa, impilo yeshalofu ende uma kuqhathaniswa nezinga lokushisa legumbi. Okunamathiselwe kwe-solder kwekhwalithi ephezulu okuhlukile, ukupakishwa okuhle nokuvumelana nezimo (10 cc/usekelo), ukubukeka okuthambile.

Iyini i-solder tin paste?

• I-Solder tin paste iwuhlobo olusha lwezinto ezithengiswayo ezifika ne-SMT.
• I-solder paste iwuhlelo oluyinkimbinkimbi olwenziwa ngokunamathisela kwe-solder powder, i-flux, nezinye izithasiselo.
• Emazingeni okushisa ajwayelekile, i-solder tin paste ine-viscosity ethile, futhi ingxenye ye-elekthronikhi ingalandelwa ekuqaleni endaweni enqunywe kusengaphambili.
• Emazingeni okushisa e-soldering, ingxenye edayisiwe kanye nephedi yesifunda ephrintiwe kuthengiswa ndawonye(Uxhumano oluhlala njalo.) ngokuhwamuka kwe-solvent nezinye izithasiselo.

 

Indlela yokulondoloza:

• I-solder paste kufanele igcinwe ku-1-10 ℃.
• Ngaphambi kokuvula, izinga lokushisa le-solder unamathisele kufanele liphakanyiswe izinga lokushisa le-ambient (25 ℃), futhi isikhathi sokubuya kwezinga lokushisa kufanele sibe amahora angama-3-4.
• I-solder paste kufanele isetshenziswe izinyanga ezingu-6.
• I-solder paste akufanele ibekwe elangeni.

Ukuqapha:

• Sebenzisa kuphela I-Ventilation eyanele.
• I-solder paste iqukethe i-solvent ephilayo. Gwema ukuthintana nesikhumba ngokuphindaphindiwe. Uma i-solder paste ifika esikhumbeni sakho, yisule ngotshwala bese ugeza kahle ngamanzi.
• Gwema ukuthintana namehlo.
• Gwema kude nezingane.